Description

Set up to circuit type characterized as SP3T. Provides a 2.4GHz ~ 2.5GHz frequency range for wide-spectrum applications. Accommodates 46dBm IIP3 for linearity and RF efficiency. Set with 50Ohm impedance to ensure signal integrity. Provides 0.75dB insertion loss for reduced signal attenuation. Provides 35dB isolation to avoid electrical interference. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 90°C for thermal stability. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 8-XFQFN Exposed Pad providing mechanical and thermal shielding. Enclosure type 8-MLP (1.1x1.1) ensuring device integrity. Product condition Active for availability and lifecycle. Type of RF Bluetooth, WLAN for specifications on frequency and modulation. Manufacturer package type 8-MLP (1.1x1.1) for component choice. Voltage supply 3V ~ 5V for electrical needs. Frequency test 2.5GHz for performance assessment. Operating supply voltage 3V ~ 5V for the device.