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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Plug Application Role | Daughtercard | |
| Interface Connector Category | Header, Male Pins | |
| Plug Design Type | High Density (HDC, HDI, HPC) | |
| Populated Position Count | All | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Grid Row Count | 4 | |
| Attachment Mounting Style | Through Hole | |
| Circuit End Method | Solder | |
| Pin Surface Treatment | - | |
| Pin Coating Depth | 30µin (0.76µm) | |
| Visual Hue | Black |
Description
Measures resistance at forward current Header, Male Pins for LED or diode evaluation. Available in a color identified as Black to enhance system aesthetics. Employs a connector style identified as High Density (HDC, HDI, HPC). Incorporates a connector type labeled as Header, Male Pins. Designed for connector functions characterized as Daughtercard. Presents contact finish thickness recorded at 30µin (0.76µm). Mounting style Through Hole for structural integrity. Loaded positions All for mechanical assembly. Total rows 4 for matrix or display setup. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Termination method Solder for electrical or mechanical linkage. Peak Vce(on) at Vge Daughtercard for transistor parameters.
