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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Plug Application Role | Coplanar, Daughtercard | |
| Interface Connector Category | Header, Male Pins | |
| Plug Design Type | High Density (HDC, HDI, HPC) | |
| Populated Position Count | All | |
| Component Spacing Distance | 0.075" (1.91mm) | |
| Grid Row Count | 12 | |
| Attachment Mounting Style | Through Hole, Right Angle | |
| Circuit End Method | Press-Fit | |
| Pin Surface Treatment | Gold | |
| Pin Coating Depth | 30µin (0.76µm) | |
| Visual Hue | Black |
Description
Measures resistance at forward current Header, Male Pins for LED or diode evaluation. Available in a color identified as Black to enhance system aesthetics. Employs a connector style identified as High Density (HDC, HDI, HPC). Incorporates a connector type labeled as Header, Male Pins. Designed for connector functions characterized as Coplanar, Daughtercard. Includes contact finish plated at Gold to enhance conductivity. Presents contact finish thickness recorded at 30µin (0.76µm). Mounting style Through Hole, Right Angle for structural integrity. Loaded positions All for mechanical assembly. Total rows 12 for matrix or display setup. Spacing 0.075" (1.91mm) for component arrangement or connector alignment. Termination method Press-Fit for electrical or mechanical linkage. Peak Vce(on) at Vge Coplanar, Daughtercard for transistor parameters.