Stock: 195
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 618.55 | ₹ 618.55 |
Stock: 29
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 619.81 | ₹ 619.81 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | SOIC | |
| Grid Pin Array Count | 16 (2 x 8) | |
| Mating Connector Pitch | 0.050" (1.27mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | 100.0µin (2.54µm) | |
| Connecting Pin Material | Copper Alloy | |
| Attachment Mounting Style | Surface Mount | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.050" (1.27mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 100.0µin (2.54µm) | |
| Solder Tail Material | Copper Alloy | |
| Casing Build Material | Thermoplastic | |
| Ambient Temp Range | - |
Description
Provides connector spacing specified as 0.050" (1.27mm) for appropriate PCB arrangement. Features mating contact finish rated at Tin. Delivers post contact finish characterized by Tin. Contains mating finish thickness indicated as 100.0µin (2.54µm). Designed with post finish thickness assessed at 100.0µin (2.54µm). Employs mating contact material identified as Copper Alloy. Contains post contact material categorized as Copper Alloy. Furnished with features classified as Closed Frame. Made from Thermoplastic housing material to ensure strength and dependability. Mounting style Surface Mount for structural integrity. Pins or positions on grid 16 (2 x 8) for connector arrangement. Enclosure Bulk for component protection or transport. Alignment pitch 0.050" (1.27mm) for connection with counterpart. Post spacing 0.050" (1.27mm) for mounting or PCB compatibility. Product condition Active for availability and lifecycle. Termination method Solder for electrical or mechanical linkage. Category SOIC for classification or specification.