Attribute
Description
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Stock: 174
Distributor: 122
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 116.41 | ₹ 116.41 |
Stock: 174
Distributor: 111
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 3 | ₹ 236.95 | ₹ 710.85 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | MSOP, SOIC, TSSOP | |
| Switch Position Options | 8 | |
| Component Spacing Distance | - | |
| Circuit Board Depth | - | |
| Construction Material Type | - | |
| Package Size Specs | 0.550" L x 0.425" W (13.97mm x 10.80mm) |
Description
Total positions 8 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted MSOP, SOIC, TSSOP for production or assembly. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping. Dimensions 0.550" L x 0.425" W (13.97mm x 10.80mm) for mechanical or electrical components. Dimension measurement 0.550" L x 0.425" W (13.97mm x 10.80mm) for component details.
