Attribute
Description
Manufacturer Part Number
PC609BL40
Manufacturer
Description
9 Ball BGA to DIP with Stencil
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | BGA | |
| Switch Position Options | 9 | |
| Component Spacing Distance | 0.016" (0.40mm) | |
| Circuit Board Depth | 0.062" (1.57mm) 1/16" | |
| Construction Material Type | - | |
| Package Size Specs | 0.600" L x 0.400" W (15.24mm x 10.16mm) |
Description
Features a board thickness rated at 0.062" (1.57mm) 1/16" for robust structural support. Total positions 9 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted BGA for production or assembly. Spacing 0.016" (0.40mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping. Dimensions 0.600" L x 0.400" W (15.24mm x 10.16mm) for mechanical or electrical components. Dimension measurement 0.600" L x 0.400" W (15.24mm x 10.16mm) for component details.
