Attribute
Description
Manufacturer Part Number
PC90891-6
Manufacturer
Description
SOT-891-6 to DIP with Stencil
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SOT-891-6 | |
| Switch Position Options | 6 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Circuit Board Depth | 0.062" (1.57mm) 1/16" | |
| Construction Material Type | - | |
| Package Size Specs | 0.400" L x 0.300" W (10.16mm x 7.62mm) |
Description
Features a board thickness rated at 0.062" (1.57mm) 1/16" for robust structural support. Total positions 6 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted SOT-891-6 for production or assembly. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping. Dimensions 0.400" L x 0.300" W (10.16mm x 7.62mm) for mechanical or electrical components. Dimension measurement 0.400" L x 0.300" W (10.16mm x 7.62mm) for component details.
