ST-SD-USDV2.0

ST-SD-USDV2.0
Attribute
Description
Manufacturer Part Number
ST-SD-USDV2.0
Manufacturer
Description
SD TO MICROSD CONVERTER V2.0
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Prototype Board Style Connector to Plated Through Hole
Supported Package Formats SD Card
Switch Position Options 10
Component Spacing Distance 0.100" (2.54mm)
Circuit Board Depth -
Construction Material Type FR4 Epoxy Glass
Package Size Specs -

Description

Material type FR4 Epoxy Glass for reliability and performance. Total positions 10 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted SD Card for production or assembly. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type Connector to Plated Through Hole for prototyping.

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