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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | MLS | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Storage Capacity Electrical | 560 µF | |
| Accuracy Tolerance Percentage | ±20% | |
| Rated Operating Voltage | 250 V | |
| Series Resistance Equivalent | 240mOhm | |
| Expected Life at Temperature | 10000 Hrs @ 85°C | |
| Ambient Temp Range | -55°C ~ 125°C | |
| Optical Polarization Mode | - | |
| Performance Rating Specs | - | |
| Intended Uses | General Purpose | |
| Low-Freq Ripple Amps | - | |
| High-Freq Ripple Amps | - | |
| AC Resistance Value | - | |
| Pin Lead Gap | 1.000" (25.40mm) | |
| Package Size Specs | 3.000" L x 1.750" W (76.20mm x 44.45mm) | |
| Maximum Mounted Height | 0.500" (12.70mm) | |
| SMD Pad Footprint | - | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | FlatPack |
Description
Ideally suited for scenarios involving General Purpose. Offers a capacitance level rated at 560 µF to ensure circuit stability. Offers ESR rated at 240mOhm. Maximum seated height of 0.500" (12.70mm) for components mounted on the board. Lead spacing 1.000" (25.40mm) for compliance with PCB design. Functions with a lifespan of 10000 Hrs @ 85°C at designated temperature. Mounting style Through Hole for structural integrity. Operating temperature -55°C ~ 125°C for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case FlatPack providing mechanical and thermal shielding. Product condition Active for availability and lifecycle. Product or component classification series MLS. Dimensions 3.000" L x 1.750" W (76.20mm x 44.45mm) for mechanical or electrical components. Dimension measurement 3.000" L x 1.750" W (76.20mm x 44.45mm) for component details. Tolerance ±20% for precision in manufacturing. Operating voltage rating 250 V for device specifications.
