Attribute
Description
Manufacturer Part Number
ATS-1039-C1-R0
Manufacturer
Description
HEATSINK 40X38X15MM NYLONPUSHPIN
Note :
GST will not be applied to orders shipping outside of India
Stock: 12
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 500 | ₹ 1,234.07 | ₹ 6,17,035.00 |
| 300 | ₹ 1,268.18 | ₹ 3,80,454.00 |
| 100 | ₹ 1,344.67 | ₹ 1,34,467.00 |
| 50 | ₹ 1,395.21 | ₹ 69,760.50 |
| 25 | ₹ 1,447.59 | ₹ 36,189.75 |
| 10 | ₹ 1,519.79 | ₹ 15,197.90 |
| 1 | ₹ 1,716.93 | ₹ 1,716.93 |
Stock: 100
Distributor: 133
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 100 | ₹ 1,254.01 | ₹ 1,25,401.00 |
Stock: 50
Distributor: 11
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 1,335.89 | ₹ 66,794.50 |
| 20 | ₹ 1,391.07 | ₹ 27,821.40 |
| 10 | ₹ 1,474.73 | ₹ 14,747.30 |
| 5 | ₹ 1,640.27 | ₹ 8,201.35 |
| 1 | ₹ 1,796.91 | ₹ 1,796.91 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | maxiFLOW | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | BGA | |
| Mounting Technique | Push Pin | |
| Physical Shape Form | Rectangular, Angled Fins | |
| Linear Length Dimension | 1.575" (40.00mm) | |
| Horizontal Width Dimension | 1.500" (38.10mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.590" (15.00mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 2.50°C/W @ 300 LFM | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Green Anodized |
Description
Secured using a Push Pin approach for stable positioning. Has fin height recorded at 0.590" (15.00mm). Total length 1.575" (40.00mm) for size reference. Material type Aluminum for reliability and performance. Finish Green Anodized for both protection and visual appeal. Enclosure Bulk for component protection or transport. Thermal management package BGA for cooling purposes. Product condition Active for availability and lifecycle. Product or component classification series maxiFLOW. Form Rectangular, Angled Fins for device or component. Thermal resistance under forced airflow 2.50°C/W @ 300 LFM for cooling effectiveness. Category Top Mount for classification or specification. Horizontal dimension width 1.500" (38.10mm).
