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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | TO-263 (D²Pak) | |
| Mounting Technique | SMD Pad | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 0.500" (12.70mm) | |
| Horizontal Width Dimension | 1.031" (26.20mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.390" (9.91mm) | |
| Power at Temp Increase | 1.3W @ 30°C | |
| Thermal Resistance with Fan | 10.00°C/W @ 200 LFM | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Copper | |
| Surface Material Treatment | Tin |
Description
Secured using a SMD Pad approach for stable positioning. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Has fin height recorded at 0.390" (9.91mm). Total length 0.500" (12.70mm) for size reference. Material type Copper for reliability and performance. Finish Tin for both protection and visual appeal. Enclosure Bulk for component protection or transport. Thermal management package TO-263 (D²Pak) for cooling purposes. Power dissipation at elevated temperature 1.3W @ 30°C for device durability. Product condition Obsolete for availability and lifecycle. Form Rectangular, Fins for device or component. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Thermal resistance under forced airflow 10.00°C/W @ 200 LFM for cooling effectiveness. Category Top Mount for classification or specification. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. Horizontal dimension width 1.031" (26.20mm).
