Attribute
Description
Manufacturer Part Number
APR27-27-12CB/M
Manufacturer
Description
HEATSINK FORGED WITH MEDIUM CLIP
Note :
GST will not be applied to orders shipping outside of India
Stock: 300
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 300 | ₹ 413.85 | ₹ 1,24,155.00 |
| 525 | ₹ 403.17 | ₹ 2,11,664.25 |
| 1050 | ₹ 388.04 | ₹ 4,07,442.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | APR | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Assorted (BGA, LGA, CPU, ASIC...) | |
| Mounting Technique | Clip | |
| Physical Shape Form | Square, Pin Fins | |
| Linear Length Dimension | 1.047" (26.60mm) | |
| Horizontal Width Dimension | 1.047" (26.60mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.457" (11.60mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 5.30°C/W @ 200 LFM | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Secured using a Clip approach for stable positioning. Has fin height recorded at 0.457" (11.60mm). Total length 1.047" (26.60mm) for size reference. Material type Aluminum for reliability and performance. Finish Black Anodized for both protection and visual appeal. Enclosure Box for component protection or transport. Thermal management package Assorted (BGA, LGA, CPU, ASIC...) for cooling purposes. Product condition Active for availability and lifecycle. Product or component classification series APR. Form Square, Pin Fins for device or component. Thermal resistance under forced airflow 5.30°C/W @ 200 LFM for cooling effectiveness. Category Top Mount for classification or specification. Horizontal dimension width 1.047" (26.60mm).
