Attribute
Description
Manufacturer Part Number
TG-NSP50-1LB
Manufacturer
Description
NON-SILICONE THERMAL PUTTY 1LB D
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | TG-NSP50 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Non-Silicone Putty | |
| Package Size Specs | 1 lb Can | |
| Effective Temp Window | -40°F ~ 392°F (-40°C ~ 200°C) | |
| Visual Hue | Gray | |
| Heat Transfer Coefficient | 5.40W/m-K | |
| Key Product Highlights | - | |
| Storage Duration Limit | 60 Months | |
| Cool Storage Temp Range | - |
Description
Available in a color identified as Gray to enhance system aesthetics. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series TG-NSP50. Product lifespan 60 Months for longevity. Dimensions 1 lb Can for mechanical or electrical components. Dimension measurement 1 lb Can for component details. Thermal conductivity value 5.40W/m-K for heat transfer efficiency. Category Non-Silicone Putty for classification or specification. Temperature range -40°F ~ 392°F (-40°C ~ 200°C) suitable for safe operation.
