Attribute
Description
Manufacturer Part Number
TW-T200-01-10
Manufacturer
Description
THERM PAD 300MMX200MM BLUE
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Sheet | |
| Availability Status | Active | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | - | |
| Dimensional Outline Drawing | 300.00mm x 200.00mm | |
| Material Thickness Gauge | 0.0394" (1.000mm) | |
| Construction Material Type | Silicone Elastomer | |
| Bonding Agent Type | - | |
| Support Layer Material | Fiberglass | |
| Visual Hue | Blue | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 2.0W/m-K |
Description
Made with Fiberglass backing/carrier materials for longevity. Available in a color identified as Blue to enhance system aesthetics. Material type Silicone Elastomer for reliability and performance. Contour 300.00mm x 200.00mm for device shape and footprint. Enclosure Sheet for component protection or transport. Product condition Active for availability and lifecycle. Thermal conductivity value 2.0W/m-K for heat transfer efficiency. Thickness measurement 0.0394" (1.000mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification. Application Multi for intended use or function.
