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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | WGCF20 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 150.00mm x 50.00mm | |
| Material Thickness Gauge | 0.0790" (2.000mm) | |
| Construction Material Type | Silicone Rubber | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | Black | |
| Material Heat Resistance | 0.07°C/W | |
| Heat Transfer Coefficient | 20W/m-K |
Description
Available in a color identified as Black to enhance system aesthetics. Material type Silicone Rubber for reliability and performance. Contour 150.00mm x 50.00mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series WGCF20. Form Rectangular for device or component. Thermal conductivity value 20W/m-K for heat transfer efficiency. Thermal resistivity value 0.07°C/W for insulation or material effectiveness. Thickness measurement 0.0790" (2.000mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification. Application Multi for intended use or function.
