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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Sil-Pad® 2000/TSP 3500® | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | Rectifier | |
| Device Type Classification | Pad, Sheet | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 25.40mm x 25.40mm | |
| Material Thickness Gauge | 0.0200" (0.508mm) | |
| Construction Material Type | Silicone Elastomer | |
| Bonding Agent Type | - | |
| Support Layer Material | Fiberglass | |
| Visual Hue | White | |
| Material Heat Resistance | 0.33°C/W | |
| Heat Transfer Coefficient | 3.5W/m-K |
Description
Made with Fiberglass backing/carrier materials for longevity. Available in a color identified as White to enhance system aesthetics. Material type Silicone Elastomer for reliability and performance. Contour 25.40mm x 25.40mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Sil-Pad® 2000/TSP 3500®. Form Square for device or component. Thermal conductivity value 3.5W/m-K for heat transfer efficiency. Thermal resistivity value 0.33°C/W for insulation or material effectiveness. Thickness measurement 0.0200" (0.508mm) for material or component size. Category Pad, Sheet for classification or specification. Application Rectifier for intended use or function.
