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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Gap Pad® 3500ULM | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | Thermally Conductive | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 406.40mm x 203.20mm | |
| Material Thickness Gauge | 0.0200" (0.508mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | Tacky - Both Sides | |
| Support Layer Material | Fiberglass | |
| Visual Hue | Gray | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 3.5W/m-K |
Description
Uses Tacky - Both Sides adhesive for durable bonding. Made with Fiberglass backing/carrier materials for longevity. Available in a color identified as Gray to enhance system aesthetics. Material type Silicone for reliability and performance. Contour 406.40mm x 203.20mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Gap Pad® 3500ULM. Form Rectangular for device or component. Thermal conductivity value 3.5W/m-K for heat transfer efficiency. Thickness measurement 0.0200" (0.508mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification. Application Thermally Conductive for intended use or function.
