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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Hi-Flow® 115-AC | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | SIP | |
| Device Type Classification | Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 36.83mm x 21.29mm | |
| Material Thickness Gauge | 0.0055" (0.140mm) | |
| Construction Material Type | Phase Change Compound | |
| Bonding Agent Type | Adhesive - One Side | |
| Support Layer Material | Fiberglass | |
| Visual Hue | Gray | |
| Material Heat Resistance | 0.35°C/W | |
| Heat Transfer Coefficient | 0.8W/m-K |
Description
Uses Adhesive - One Side adhesive for durable bonding. Made with Fiberglass backing/carrier materials for longevity. Available in a color identified as Gray to enhance system aesthetics. Material type Phase Change Compound for reliability and performance. Contour 36.83mm x 21.29mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Hi-Flow® 115-AC. Form Rectangular for device or component. Thermal conductivity value 0.8W/m-K for heat transfer efficiency. Thermal resistivity value 0.35°C/W for insulation or material effectiveness. Thickness measurement 0.0055" (0.140mm) for material or component size. Category Pad, Sheet for classification or specification. Application SIP for intended use or function.
