Attribute
Description
Manufacturer Part Number
SPK10-0.006-00-25
Manufacturer
Description
THERM PAD 25.4MMX6.6MM BEIGE
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Sil-Pad® K-10 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | DO-5 | |
| Device Type Classification | Pad, Sheet | |
| Physical Shape Form | Round | |
| Dimensional Outline Drawing | 25.40mm x 6.60mm | |
| Material Thickness Gauge | 0.0060" (0.152mm) | |
| Construction Material Type | Silicone Rubber | |
| Bonding Agent Type | - | |
| Support Layer Material | Polyimide | |
| Visual Hue | Beige | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 1.3W/m-K |
Description
Made with Polyimide backing/carrier materials for longevity. Available in a color identified as Beige to enhance system aesthetics. Material type Silicone Rubber for reliability and performance. Contour 25.40mm x 6.60mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Sil-Pad® K-10. Form Round for device or component. Thermal conductivity value 1.3W/m-K for heat transfer efficiency. Thickness measurement 0.0060" (0.152mm) for material or component size. Category Pad, Sheet for classification or specification. Application DO-5 for intended use or function.
