Stock: 20
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 20 | ₹ 38,642.02 | ₹ 7,72,840.40 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | Tflex™ HR400 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 457.20mm x 457.20mm | |
| Material Thickness Gauge | 0.226" (5.75mm) | |
| Construction Material Type | Silicone, Ceramic Filled | |
| Bonding Agent Type | Tacky - One Side | |
| Support Layer Material | - | |
| Visual Hue | Gray | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 1.8W/m-K |
Description
Uses Tacky - One Side adhesive for durable bonding. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Available in a color identified as Gray to enhance system aesthetics. Material type Silicone, Ceramic Filled for reliability and performance. Contour 457.20mm x 457.20mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Obsolete for availability and lifecycle. Product or component classification series Tflex™ HR400. Form Square for device or component. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Thermal conductivity value 1.8W/m-K for heat transfer efficiency. Thickness measurement 0.226" (5.75mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification. Application Multi for intended use or function. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters.
