HF115AC-0.0055-AC-54

HF115AC-0.0055-AC-54
Attribute
Description
Manufacturer Part Number
HF115AC-0.0055-AC-54
Manufacturer
Description
THERM PAD 19.05MMX12.7MM W/ADH
Note : GST will not be applied to orders shipping outside of India

Stock:
48854

Distributor: 117

Lead Time: Not specified

Quantity Unit Price Ext. Price
5000 ₹ 24.64 ₹ 1,23,200.00
1000 ₹ 26.84 ₹ 26,840.00
500 ₹ 27.84 ₹ 13,920.00
300 ₹ 28.61 ₹ 8,583.00
100 ₹ 30.32 ₹ 3,032.00
50 ₹ 31.46 ₹ 1,573.00
25 ₹ 32.64 ₹ 816.00
10 ₹ 34.25 ₹ 342.50
1 ₹ 38.35 ₹ 38.35

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Hi-Flow® 115-AC
IC Encapsulation Type Bulk
Availability Status Active
Intended Usage Scenario TO-220
Device Type Classification Pad, Sheet
Physical Shape Form Rectangular
Dimensional Outline Drawing 19.05mm x 12.70mm
Material Thickness Gauge 0.0055" (0.140mm)
Construction Material Type Phase Change Compound
Bonding Agent Type Adhesive - One Side
Support Layer Material Fiberglass
Visual Hue Gray
Material Heat Resistance 0.35°C/W
Heat Transfer Coefficient 0.8W/m-K

Description

Uses Adhesive - One Side adhesive for durable bonding. Made with Fiberglass backing/carrier materials for longevity. Available in a color identified as Gray to enhance system aesthetics. Material type Phase Change Compound for reliability and performance. Contour 19.05mm x 12.70mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Hi-Flow® 115-AC. Form Rectangular for device or component. Thermal conductivity value 0.8W/m-K for heat transfer efficiency. Thermal resistivity value 0.35°C/W for insulation or material effectiveness. Thickness measurement 0.0055" (0.140mm) for material or component size. Category Pad, Sheet for classification or specification. Application TO-220 for intended use or function.

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