SI5415AEDU-T1-GE3

SI5415AEDU-T1-GE3
Attribute
Description
Manufacturer Part Number
SI5415AEDU-T1-GE3
Manufacturer
Description
MOSFET P-CH 20V 25A PPAK
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line TrenchFET®
IC Encapsulation Type Tape & Reel (TR)
Availability Status Obsolete
Field Effect Transistor Type P-Channel
Core Technology Platform MOSFET (Metal Oxide)
Drain-Source Breakdown Volts 20 V
Continuous Drain Current at 25C 25A (Tc)
Gate Drive Voltage Range 1.8V, 4.5V
Max On-State Resistance 9.6mOhm @ 10A, 4.5V
Max Threshold Gate Voltage 1V @ 250µA
Max Gate Charge at Vgs 120 nC @ 8 V
Maximum Gate Voltage ±8V
Max Input Cap at Vds 4300 pF @ 10 V
Transistor Special Function -
Max Heat Dissipation 3.1W (Ta), 31W (Tc)
Ambient Temp Range -50°C ~ 150°C (TJ)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Vendor Package Type PowerPAK® ChipFet Single
Component Housing Style PowerPAK® ChipFET™ Single

Description

Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Supports a continuous drain current (Id) of 25A (Tc) at 25°C. Supports Vdss drain-to-source voltage rated at 20 V. Accommodates drive voltage specified at 1.8V, 4.5V for RdsOn regulation. Accommodates FET classification identified as P-Channel. Guarantees maximum 120 nC @ 8 V gate charge at Vgs for enhanced switching efficiency. Upholds 120 nC @ 8 V gate charge at Vgs for reliable MOSFET functionality. The highest input capacitance is 4300 pF @ 10 V at Vds for safeguarding the device. The input capacitance is rated at 4300 pF @ 10 V at Vds for optimal performance. Mounting style Surface Mount for structural integrity. Operating temperature -50°C ~ 150°C (TJ) for thermal stability. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case PowerPAK® ChipFET™ Single providing mechanical and thermal shielding. Enclosure type PowerPAK® ChipFet Single ensuring device integrity. Highest power dissipation 3.1W (Ta), 31W (Tc) for effective thermal control. Product condition Obsolete for availability and lifecycle. Peak Rds(on) at Id 120 nC @ 8 V for MOSFET efficiency. Peak Rds(on) at Id and Vgs 9.6mOhm @ 10A, 4.5V for MOSFET criteria. Product or component classification series TrenchFET®. Manufacturer package type PowerPAK® ChipFet Single for component choice. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Platform technology MOSFET (Metal Oxide) for the type of product. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. Peak Vgs ±8V for MOSFET parameters. Peak Vgs(th) at Id 1V @ 250µA for MOSFET threshold level.

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