Attribute
Description
Manufacturer Part Number
MAX6499ATA+T
Manufacturer
Description
TVS DEVICE MIXED 8-TDFN
Note :
GST will not be applied to orders shipping outside of India
Stock: 1339
Distributor: 121
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 781.75 | ₹ 781.75 |
| 10 | ₹ 674.47 | ₹ 6,744.70 |
| 25 | ₹ 674.26 | ₹ 16,856.50 |
| 100 | ₹ 674.05 | ₹ 67,405.00 |
| 250 | ₹ 660.58 | ₹ 1,65,145.00 |
| 500 | ₹ 647.10 | ₹ 3,23,550.00 |
| 2500 | ₹ 633.61 | ₹ 15,84,025.00 |
Stock: 1638
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 791.21 | ₹ 791.21 |
| 10 | ₹ 682.63 | ₹ 6,826.30 |
| 500 | ₹ 673.73 | ₹ 3,36,865.00 |
| 1000 | ₹ 647.03 | ₹ 6,47,030.00 |
| 2500 | ₹ 557.14 | ₹ 13,92,850.00 |
Stock: 13068
Distributor: 141
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 791.21 | ₹ 791.21 |
| 10 | ₹ 682.63 | ₹ 6,826.30 |
| 100 | ₹ 682.21 | ₹ 68,221.00 |
| 1000 | ₹ 445.89 | ₹ 4,45,890.00 |
| 2500 | ₹ 557.36 | ₹ 13,93,400.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® | |
| Availability Status | Active | |
| Clamp Protection Level | - | |
| Core Technology Platform | Mixed Technology | |
| Electrical Circuit Count | 1 | |
| Intended Uses | General Purpose | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 8-WDFN Exposed Pad | |
| Vendor Package Type | 8-TDFN (3x3) |
Description
Ideally suited for scenarios involving General Purpose. Mounting style Surface Mount for structural integrity. Total circuits 1 for electrical or electronic designs. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 8-WDFN Exposed Pad providing mechanical and thermal shielding. Enclosure type 8-TDFN (3x3) ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type 8-TDFN (3x3) for component choice. Platform technology Mixed Technology for the type of product.