Attribute
Description
Manufacturer Part Number
BIN004
Manufacturer
Description
Breadboard Breakout
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Retail Package | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | - | |
| Switch Position Options | 10 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Circuit Board Depth | 0.063" (1.60mm) | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | 0.700" L x 0.540" W (17.78mm x 13.72mm) |
Description
Features a board thickness rated at 0.063" (1.60mm) for robust structural support. Material type FR4 Epoxy Glass for reliability and performance. Total positions 10 for switches or mechanical elements. Enclosure Retail Package for component protection or transport. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping. Dimensions 0.700" L x 0.540" W (17.78mm x 13.72mm) for mechanical or electrical components. Dimension measurement 0.700" L x 0.540" W (17.78mm x 13.72mm) for component details.
