Attribute
Description
Manufacturer Part Number
TEL-R1500-SI 150 X 150MM SHEET
Manufacturer
Description
1.5mm thick low dielectric,
high
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Sheet | |
| Availability Status | Active | |
| Intended Usage Scenario | - | |
| Device Type Classification | Gap Fillers, Thermal Pads, Thermally Conductive Tapes and Heat Spreaders | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 150.00mm x 150.00mm | |
| Material Thickness Gauge | 0.059" (1.50mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | - | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | - |
Description
Material type Silicone for reliability and performance. Contour 150.00mm x 150.00mm for device shape and footprint. Enclosure Sheet for component protection or transport. Product condition Active for availability and lifecycle. Form Square for device or component. Thickness measurement 0.059" (1.50mm) for material or component size. Category Gap Fillers, Thermal Pads, Thermally Conductive Tapes and Heat Spreaders for classification or specification.
