Attribute
Description
Manufacturer Part Number
TGF-ZP2000-SI 300 X 200MM
Manufacturer
Description
2.0mm thick electrically insulat
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Sheet | |
| Availability Status | Active | |
| Intended Usage Scenario | - | |
| Device Type Classification | Gap Fillers, Thermal Pads, Thermally Conductive Tapes and Heat Spreaders | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 300.00mm x 200.00mm | |
| Material Thickness Gauge | 0.0790" (2.000mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | - | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | - |
Description
Material type Silicone for reliability and performance. Contour 300.00mm x 200.00mm for device shape and footprint. Enclosure Sheet for component protection or transport. Product condition Active for availability and lifecycle. Form Rectangular for device or component. Thickness measurement 0.0790" (2.000mm) for material or component size. Category Gap Fillers, Thermal Pads, Thermally Conductive Tapes and Heat Spreaders for classification or specification.







