Attribute
Description
Manufacturer Part Number
21-233-SP01-100-0132
Manufacturer
Description
Ulthrasoft Thermal PAD; BLUE; 3W
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 21-233 | |
| IC Encapsulation Type | Sheet | |
| Availability Status | Active | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 812.80mm x 25.40mm | |
| Material Thickness Gauge | 0.0394" (1.000mm) | |
| Construction Material Type | Silicone, Ceramic Filled | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | Light Blue | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 3.0W/m-K |
Description
Available in a color identified as Light Blue to enhance system aesthetics. Material type Silicone, Ceramic Filled for reliability and performance. Contour 812.80mm x 25.40mm for device shape and footprint. Enclosure Sheet for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series 21-233. Form Rectangular for device or component. Thermal conductivity value 3.0W/m-K for heat transfer efficiency. Thickness measurement 0.0394" (1.000mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification. Application Multi for intended use or function.
