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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Retail Package | |
| Availability Status | Active | |
| Central CPU Unit | ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8M Dual | |
| Operational Speed Rating | 1.6GHz | |
| Processor Core Number | 4 | |
| Wattage Power Level | - | |
| Thermal Management Method | Heat Sink | |
| Package Size Specs | - | |
| Device Size Standard | Rackmount | |
| Expansion Slot Bus Type | M.2, Mini-PCIe | |
| Installed RAM Volume | 32GB/2GB | |
| Memory Bus Interface | eMMC, MicroSD | |
| Display Video Ports | Display Port, HDMI | |
| Network Ethernet Standard | GbE (2), RJ45 (2) | |
| USB Interface Version | USB 2.0 (1), USB 3.0 (1) | |
| Serial Port Standards | - | |
| Digital Input/Output Pins | - | |
| Analog Signal In to Out | - | |
| System Monitor Timer | No | |
| Included Components | - | |
| Ambient Temp Range | -20°C ~ 70°C |
Description
Employs cooling type categorized as Heat Sink. Incorporates core processor recognized as ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8M Dual for rapid processing. Supports Ethernet standard rated to GbE (2), RJ45 (2). Includes expansion slot or bus type rated to M.2, Mini-PCIe. Showcases a form factor categorized as Rackmount. Total cores 4 for processors or cables. Operating temperature -20°C ~ 70°C for thermal stability. Enclosure Retail Package for component protection or transport. Product condition Active for availability and lifecycle. Installed RAM size 32GB/2GB for performance in computing. Velocity 1.6GHz for mechanical or data efficiency. Storage interface eMMC, MicroSD for connection purposes. USB version USB 2.0 (1), USB 3.0 (1) for connectivity. Video connections Display Port, HDMI for display or graphics output. Timer No for system monitoring purposes.
