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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | BoB | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Prototype Board Style | Connector to Breadboard | |
| Supported Package Formats | 2.54mm | |
| Switch Position Options | 40 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Circuit Board Depth | 0.063" (1.60mm) | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | 1.254" L x 4.292" W (32.62mm x 109.01mm) |
Description
Features a board thickness rated at 0.063" (1.60mm) for robust structural support. Material type FR4 Epoxy Glass for reliability and performance. Total positions 40 for switches or mechanical elements. Enclosure Bag for component protection or transport. Formats accepted 2.54mm for production or assembly. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type Connector to Breadboard for prototyping. Product or component classification series BoB. Dimensions 1.254" L x 4.292" W (32.62mm x 109.01mm) for mechanical or electrical components. Dimension measurement 1.254" L x 4.292" W (32.62mm x 109.01mm) for component details.
