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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Obsolete | |
| Data Bit Width | 10 | |
| Digital-to-Analog Converter Count | 1 | |
| Stabilization Time us | 250µs (Typ) | |
| Exit Signal Category | Current - Buffered | |
| Balanced Output Signal | No | |
| Data Link Protocol | I2C | |
| Voltage Reference Source | Internal | |
| Analog Section Voltage | 2.7V ~ 5.5V | |
| Digital Core Voltage | 2.7V ~ 5.5V | |
| Integral Differential Nonlinearity | ±1.5, ±1 (Max) | |
| System Design Structure | Current Sink | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Component Housing Style | 9-UFBGA, WLCSP | |
| Vendor Package Type | 9-WLCSP (1.52x1.69) | |
| Attachment Mounting Style | Surface Mount | |
| Quality Grade Level | - | |
| Certification Qualification | - |
Description
Employs a Current Sink framework for enhanced efficiency. Functions via a data interface rated at I2C. Includes differential output measured at No. Upholds ±1.5, ±1 (Max) INL/DNL in LSB for accurate ADC performance. Mounting style Surface Mount for structural integrity. Total bits 10 for digital clarity. Total converters 1 for power or signal conversion. Total D/A converters 1 for converting digital signals to analog. Operating temperature -40°C ~ 85°C for thermal stability. Output type Current - Buffered for system compatibility. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case 9-UFBGA, WLCSP providing mechanical and thermal shielding. Enclosure type 9-WLCSP (1.52x1.69) ensuring device integrity. Product condition Obsolete for availability and lifecycle. Reference category Internal for identifying components. Signal stabilization settling time 250µs (Typ). Manufacturer package type 9-WLCSP (1.52x1.69) for component choice. Analog voltage supply 2.7V ~ 5.5V for circuits. Digital voltage supply 2.7V ~ 5.5V for electronic devices.
