Attribute
Description
Manufacturer Part Number
EP2AGX65DF29I3N
Manufacturer
Description
IC FPGA 364 I/O 780FBGA
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Logic Array Block Count | 2530 | |
| Configurable Logic Cells | 60214 | |
| Complete RAM Bit Count | 5371904 | |
| I/O Pins | 364 | |
| Logic Gate Total | - | |
| Single/Dual (±) | 0.87 V ~ 0.93 V | |
| Attachment Mounting Style | Surface Mount | |
| Ambient Temp Range | -40°C ~ 100°C | |
| Component Housing Style | 780-BBGA, FCBGA |
Description
Measures resistance at forward current 60214 for LED or diode evaluation. Mounting style Surface Mount for structural integrity. Total I/O 364 for digital connections. Total LABs/CLBs 2530 for FPGA setup. Total logic elements/cells 60214 for programmable devices. Operating temperature -40°C ~ 100°C for thermal stability. Enclosure/case 780-BBGA, FCBGA providing mechanical and thermal shielding. Total RAM bits 5371904 for memory requirements. Peak Vce(on) at Vge 2530 for transistor parameters.
