EOS3FLF512-PDN64

EOS3FLF512-PDN64
Attribute
Description
Manufacturer Part Number
EOS3FLF512-PDN64
Description
EOS S3 ULTRA LOW POWER SENSOR &
Note : GST will not be applied to orders shipping outside of India

Stock:
735

Distributor: 108

Lead Time: Not specified

Quantity Unit Price Ext. Price
1 ₹ 416.52 ₹ 416.52

Stock:
490

Distributor: 113

Lead Time: Not specified


Quantity Unit Price Ext. Price
3 ₹ 549.49 ₹ 1,648.47
10 ₹ 538.27 ₹ 5,382.70
25 ₹ 529.55 ₹ 13,238.75
50 ₹ 523.32 ₹ 26,166.00
125 ₹ 508.37 ₹ 63,546.25

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line EOS S3
IC Encapsulation Type Tray
Availability Status Active
Inductor Core Material 32-Bit ARM M4F
Operational Speed Rating 80 MHz
User Interface Type I2C, UART, SPI, PDM, I2S, 12-bit ADC
Programmable RAM Size 512K
Embedded SRAM in FPGA 64kb
Non-Volatile Memory Capacity -
Static RAM Data Capacity 512K
FPGA Logic Cell Count 891
Equivalent Gate Array 2k
Configurable Register Count 891
Power Supply Voltage 1.1V
Attachment Mounting Style Surface Mount
Ambient Temp Range -20°C ~ 85°C (TJ)
Component Housing Style 64-TFBGA
Vendor Package Type 64-BGA (3.5mm x 3.5mm)

Description

Employs core type classified as 32-Bit ARM M4F. Contains SRAM data capacity quantified at 512K bytes. Presents FPGA core cells totaled at 891. Shows FPGA gate quantity recorded at 2k. Displays FPGA registers totaled as 891. Features FPGA SRAM capacity evaluated at 64kb. Interface tailored for I2C, UART, SPI, PDM, I2S, 12-bit ADC operation and interaction. Mounting style Surface Mount for structural integrity. Operating temperature -20°C ~ 85°C (TJ) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 64-TFBGA providing mechanical and thermal shielding. Enclosure type 64-BGA (3.5mm x 3.5mm) ensuring device integrity. Product condition Active for availability and lifecycle. SRAM size in bytes 512K for quick memory access. Product or component classification series EOS S3. Velocity 80 MHz for mechanical or data efficiency. Manufacturer package type 64-BGA (3.5mm x 3.5mm) for component choice. Voltage supply 1.1V for electrical needs. Operating supply voltage 1.1V for the device.

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