Description

Features additional interface options rated at CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART for enhanced functionality. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Incorporates co-processing or DSP hardware categorized as Multimedia; NEON™ SIMD. Incorporates core processor recognized as ARM® Cortex®-A7 for rapid processing. Incorporates display and interface processors specified as LCD, LVDS. Supports Ethernet standard rated to 10/100Mbps (2). Provides No graphics acceleration for seamless visual performance. Mounting style Surface Mount for structural integrity. Bus width or cores 1 Core, 32-Bit for digital applications. Operating temperature -40°C ~ 105°C (TJ) for thermal stability. Output voltage 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V for electrical efficiency. Enclosure Tray for component protection or transport. Enclosure/case 289-LFBGA providing mechanical and thermal shielding. Enclosure type 289-MAPBGA (14x14) ensuring device integrity. Product condition Active for availability and lifecycle. Controllers for RAM LPDDR2, DDR3, DDR3L for managing memory. Protection features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS for device security. Product or component classification series i.MX6UL. Velocity 528MHz for mechanical or data efficiency. Manufacturer package type 289-MAPBGA (14x14) for component choice. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. USB version USB 2.0 + PHY (2) for connectivity. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. I/O voltage level 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V for digital interfaces.