Description

Features additional interface options rated at AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART for enhanced functionality. Incorporates co-processing or DSP hardware categorized as Multimedia; NEON™ MPE. Incorporates core processor recognized as ARM® Cortex®-A7, ARM® Cortex®-M4 for rapid processing. Incorporates display and interface processors specified as Keypad, LCD, MIPI. Supports Ethernet standard rated to 10/100/1000Mbps (2). Provides No graphics acceleration for seamless visual performance. Mounting style Surface Mount for structural integrity. Bus width or cores 2 Core, 32-Bit for digital applications. Operating temperature -20°C ~ 105°C (TJ) for thermal stability. Output voltage 1.8V, 3.3V for electrical efficiency. Enclosure Tray for component protection or transport. Enclosure/case 541-LFBGA providing mechanical and thermal shielding. Enclosure type 541-MAPBGA (19x19) ensuring device integrity. Product condition Active for availability and lifecycle. Controllers for RAM LPDDR2, LPDDR3, DDR3, DDR3L for managing memory. Protection features A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS for device security. Product or component classification series i.MX7D. Velocity 1.0GHz for mechanical or data efficiency. Manufacturer package type 541-MAPBGA (19x19) for component choice. USB version USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) for connectivity. I/O voltage level 1.8V, 3.3V for digital interfaces.