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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | i.MX7D | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Central CPU Unit | ARM® Cortex®-A7, ARM® Cortex®-M4 | |
| Bus Core Width Bits | 2 Core, 32-Bit | |
| Operational Speed Rating | 1.0GHz | |
| Digital Signal Processors | Multimedia; NEON™ MPE | |
| Memory Management Units | LPDDR2, LPDDR3, DDR3, DDR3L | |
| GPU Speed Enhancement | No | |
| Screen and UI Processors | Keypad, LCD, MIPI | |
| Network Ethernet Standard | 10/100/1000Mbps (2) | |
| Serial ATA Interface | - | |
| USB Interface Version | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | |
| Input/Output Voltage Level | 1.8V, 3.3V | |
| Ambient Temp Range | -20°C ~ 105°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 488-TFBGA | |
| Vendor Package Type | 488-TFBGA (12x12) | |
| Extra Connectivity Ports | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
Description
Features additional interface options rated at AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART for enhanced functionality. Incorporates co-processing or DSP hardware categorized as Multimedia; NEON™ MPE. Incorporates core processor recognized as ARM® Cortex®-A7, ARM® Cortex®-M4 for rapid processing. Incorporates display and interface processors specified as Keypad, LCD, MIPI. Supports Ethernet standard rated to 10/100/1000Mbps (2). Provides No graphics acceleration for seamless visual performance. Mounting style Surface Mount for structural integrity. Bus width or cores 2 Core, 32-Bit for digital applications. Operating temperature -20°C ~ 105°C (TJ) for thermal stability. Output voltage 1.8V, 3.3V for electrical efficiency. Enclosure Tray for component protection or transport. Enclosure/case 488-TFBGA providing mechanical and thermal shielding. Enclosure type 488-TFBGA (12x12) ensuring device integrity. Product condition Active for availability and lifecycle. Controllers for RAM LPDDR2, LPDDR3, DDR3, DDR3L for managing memory. Protection features A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS for device security. Product or component classification series i.MX7D. Velocity 1.0GHz for mechanical or data efficiency. Manufacturer package type 488-TFBGA (12x12) for component choice. USB version USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) for connectivity. I/O voltage level 1.8V, 3.3V for digital interfaces.
