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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| RAM Technology Category | Volatile | |
| Storage Media Type | DRAM | |
| Core Technology Platform | SDRAM | |
| Total Memory Bytes | 64Mbit | |
| Storage Layout Structure | 4M x 16 | |
| Data Access Bus | Parallel | |
| Timing Pulse Rate | 166 MHz | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | 5.4 ns | |
| Power Supply Voltage | 3V ~ 3.6V | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 54-TFBGA | |
| Vendor Package Type | 54-TFBGA (8x8) |
Description
Reaches access speeds recorded at 5.4 ns for efficient data retrieval. Functions at a clock frequency of 166 MHz. Storage format DRAM for data interoperability. Memory bus Parallel for connectivity and performance. Memory arrangement 4M x 16 for optimal data retrieval. Memory total 64Mbit for device storage capability. Memory classification Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 54-TFBGA providing mechanical and thermal shielding. Enclosure type 54-TFBGA (8x8) ensuring device integrity. Product condition Obsolete for availability and lifecycle. Manufacturer package type 54-TFBGA (8x8) for component choice. Voltage supply 3V ~ 3.6V for electrical needs. Platform technology SDRAM for the type of product. Operating supply voltage 3V ~ 3.6V for the device.
