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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Obsolete | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | RAM | |
| Core Technology Platform | MRAM (Magnetoresistive RAM) | |
| Total Memory Bytes | 4Mbit | |
| Storage Layout Structure | 512K x 8 | |
| Data Access Bus | SPI | |
| Timing Pulse Rate | 50 MHz | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 3V ~ 3.6V | |
| Ambient Temp Range | 0°C ~ 70°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 8-VDFN Exposed Pad | |
| Vendor Package Type | 8-DFN-EP, Small Flag (5x6) |
Description
Functions at a clock frequency of 50 MHz. Storage format RAM for data interoperability. Memory bus SPI for connectivity and performance. Memory arrangement 512K x 8 for optimal data retrieval. Memory total 4Mbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature 0°C ~ 70°C (TA) for thermal stability. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case 8-VDFN Exposed Pad providing mechanical and thermal shielding. Enclosure type 8-DFN-EP, Small Flag (5x6) ensuring device integrity. Product condition Obsolete for availability and lifecycle. Manufacturer package type 8-DFN-EP, Small Flag (5x6) for component choice. Voltage supply 3V ~ 3.6V for electrical needs. Platform technology MRAM (Magnetoresistive RAM) for the type of product. Operating supply voltage 3V ~ 3.6V for the device.
