Stock: 1
Distributor: 116
Lead Time: Not specified
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|---|---|---|
| 1 | ₹ 5,130.41 | ₹ 5,130.41 |
Stock: 1
Distributor: 121
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 5,225.84 | ₹ 5,225.84 |
Stock: 93
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 5,318.03 | ₹ 5,318.03 |
Stock: 9
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 5,320.42 | ₹ 5,320.42 |
Stock: 50
Distributor: 129
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 13,412.83 | ₹ 6,70,641.50 |
| 25 | ₹ 13,736.03 | ₹ 3,43,400.75 |
| 10 | ₹ 14,075.18 | ₹ 1,40,751.80 |
| 5 | ₹ 14,431.52 | ₹ 72,157.60 |
| 3 | ₹ 14,616.54 | ₹ 43,849.62 |
| 2 | ₹ 14,806.37 | ₹ 29,612.74 |
| 1 | ₹ 15,001.18 | ₹ 15,001.18 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Zynq®-7000 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Non-Volatile Flash Memory | - | |
| Random Access Memory Bytes | 256KB | |
| External Device Support | DMA | |
| Interconnect Options | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Operational Speed Rating | 667MHz | |
| Key Feature Specifications | Artix™-7 FPGA, 23K Logic Cells | |
| Ambient Temp Range | 0°C ~ 85°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 225-LFBGA, CSPBGA | |
| Vendor Package Type | 225-CSPBGA (13x13) |
Description
Employs a MCU, FPGA framework for enhanced efficiency. Offers connectivity alternatives specified by CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for smooth integration. Incorporates core processor recognized as Single ARM® Cortex®-A9 MPCore™ with CoreSight™ for rapid processing. Operating temperature 0°C ~ 85°C (TJ) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 225-LFBGA, CSPBGA providing mechanical and thermal shielding. Enclosure type 225-CSPBGA (13x13) ensuring device integrity. External devices DMA for system connectivity and expansion. Key characteristics Artix™-7 FPGA, 23K Logic Cells outlining main features. Product condition Active for availability and lifecycle. Size of RAM 256KB for system or device specifications. Product or component classification series Zynq®-7000. Velocity 667MHz for mechanical or data efficiency. Manufacturer package type 225-CSPBGA (13x13) for component choice.
