Stock: 2200
Distributor: 145
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 5 | ₹ 6,391.18 | ₹ 31,955.90 |
| 4 | ₹ 7,128.62 | ₹ 28,514.48 |
| 3 | ₹ 7,374.51 | ₹ 22,123.53 |
| 2 | ₹ 7,620.30 | ₹ 15,240.60 |
| 1 | ₹ 7,866.08 | ₹ 7,866.08 |
Stock: 30
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 33,359.99 | ₹ 33,359.99 |
Stock: 4
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 33,375.00 | ₹ 33,375.00 |
Stock: 1
Distributor: 130
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 34,157.40 | ₹ 34,157.40 |
Stock: 1
Distributor: 121
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 35,737.66 | ₹ 35,737.66 |
Stock: 1
Distributor: 116
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 36,045.00 | ₹ 36,045.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Zynq®-7000 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Non-Volatile Flash Memory | - | |
| Random Access Memory Bytes | 256KB | |
| External Device Support | DMA | |
| Interconnect Options | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Operational Speed Rating | 667MHz | |
| Key Feature Specifications | Kintex™-7 FPGA, 125K Logic Cells | |
| Ambient Temp Range | 0°C ~ 85°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 676-BBGA, FCBGA | |
| Vendor Package Type | 676-FCBGA (27x27) |
Description
Employs a MCU, FPGA framework for enhanced efficiency. Offers connectivity alternatives specified by CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for smooth integration. Incorporates core processor recognized as Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ for rapid processing. Operating temperature 0°C ~ 85°C (TJ) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 676-BBGA, FCBGA providing mechanical and thermal shielding. Enclosure type 676-FCBGA (27x27) ensuring device integrity. External devices DMA for system connectivity and expansion. Key characteristics Kintex™-7 FPGA, 125K Logic Cells outlining main features. Product condition Active for availability and lifecycle. Size of RAM 256KB for system or device specifications. Product or component classification series Zynq®-7000. Velocity 667MHz for mechanical or data efficiency. Manufacturer package type 676-FCBGA (27x27) for component choice.
