M2S025-FGG484

M2S025-FGG484
Attribute
Description
Manufacturer Part Number
M2S025-FGG484
Description
IC SOC CORTEX-M3 166MHZ 484FBGA
Note : GST will not be applied to orders shipping outside of India

Stock:
17

Distributor: 140

Lead Time: Not specified

Quantity Unit Price Ext. Price
5000 ₹ 3,430.06 ₹ 1,71,50,300.00
1000 ₹ 3,772.71 ₹ 37,72,710.00
500 ₹ 6,716.83 ₹ 33,58,415.00
250 ₹ 6,906.40 ₹ 17,26,600.00
50 ₹ 7,106.65 ₹ 3,55,332.50
1 ₹ 7,211.67 ₹ 7,211.67

Stock:
8

Distributor: 122

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 5,720.03 ₹ 5,720.03

Stock:
8

Distributor: 111

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 5,720.03 ₹ 5,720.03

Stock:
60

Distributor: 110

Lead Time: Not specified


Quantity Unit Price Ext. Price
60 ₹ 6,086.71 ₹ 3,65,202.60
45 ₹ 6,210.42 ₹ 2,79,468.90
30 ₹ 8,825.24 ₹ 2,64,757.20
15 ₹ 16,670.59 ₹ 2,50,058.85

Stock:
100

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
100 ₹ 7,103.47 ₹ 7,10,347.00
1 ₹ 7,208.43 ₹ 7,208.43

Stock:
65

Distributor: 108

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 7,211.67 ₹ 7,211.67

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line SmartFusion®2
IC Encapsulation Type Tray
Availability Status Active
System Design Structure MCU, FPGA
Central CPU Unit ARM® Cortex®-M3
Non-Volatile Flash Memory 256KB
Random Access Memory Bytes 64KB
External Device Support DDR, PCIe, SERDES
Interconnect Options CANbus, Ethernet, I2C, SPI, UART/USART, USB
Operational Speed Rating 166MHz
Key Feature Specifications FPGA - 25K Logic Modules
Ambient Temp Range 0°C ~ 85°C (TJ)
Quality Grade Level -
Certification Qualification -
Component Housing Style 484-BGA
Vendor Package Type 484-FPBGA (23x23)

Description

Employs a MCU, FPGA framework for enhanced efficiency. Offers connectivity alternatives specified by CANbus, Ethernet, I2C, SPI, UART/USART, USB for smooth integration. Incorporates core processor recognized as ARM® Cortex®-M3 for rapid processing. Presents flash memory capacity rated at 256KB. Operating temperature 0°C ~ 85°C (TJ) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 484-BGA providing mechanical and thermal shielding. Enclosure type 484-FPBGA (23x23) ensuring device integrity. External devices DDR, PCIe, SERDES for system connectivity and expansion. Key characteristics FPGA - 25K Logic Modules outlining main features. Product condition Active for availability and lifecycle. Size of RAM 64KB for system or device specifications. Product or component classification series SmartFusion®2. Velocity 166MHz for mechanical or data efficiency. Manufacturer package type 484-FPBGA (23x23) for component choice.

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