R9A06G037GNP#AA0

R9A06G037GNP#AA0
Attribute
Description
Manufacturer Part Number
R9A06G037GNP#AA0
Description
SOC PLC MODEM LSI SMART GRID ASS
Note : GST will not be applied to orders shipping outside of India

Stock:
20033

Distributor: 145

Lead Time: Not specified

Quantity Unit Price Ext. Price
100 ₹ 267.36 ₹ 26,736.00
75 ₹ 298.21 ₹ 22,365.75
58 ₹ 308.50 ₹ 17,893.00
42 ₹ 318.78 ₹ 13,388.76
28 ₹ 329.07 ₹ 9,213.96
12 ₹ 401.04 ₹ 4,812.48

Stock:
2500

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
2500 ₹ 269.68 ₹ 6,74,200.00
1000 ₹ 277.48 ₹ 2,77,480.00
500 ₹ 284.88 ₹ 1,42,440.00
250 ₹ 293.87 ₹ 73,467.50
100 ₹ 308.78 ₹ 30,878.00
25 ₹ 340.04 ₹ 8,501.00
10 ₹ 368.47 ₹ 3,684.70
1 ₹ 482.16 ₹ 482.16

Stock:
10

Distributor: 116

Lead Time: Not specified


Quantity Unit Price Ext. Price
10 ₹ 277.02 ₹ 2,770.20
1 ₹ 284.80 ₹ 284.80

Stock:
1

Distributor: 108

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 637.24 ₹ 637.24
10 ₹ 478.82 ₹ 4,788.20
25 ₹ 445.89 ₹ 11,147.25
100 ₹ 392.49 ₹ 39,249.00
250 ₹ 372.02 ₹ 93,005.00
500 ₹ 333.75 ₹ 1,66,875.00
1000 ₹ 281.24 ₹ 2,81,240.00
2500 ₹ 269.67 ₹ 6,74,175.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line RZ/T
IC Encapsulation Type Tray
Availability Status Active
System Design Structure DSP, MCU
Central CPU Unit ARM® Cortex®-M3
Non-Volatile Flash Memory -
Random Access Memory Bytes 128kB
External Device Support PWM
Interconnect Options CSI, I2C, UART
Operational Speed Rating 138MHz
Key Feature Specifications -
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Component Housing Style 64-VFQFN Exposed Pad
Vendor Package Type 64-HVQFN (9x9)

Description

Employs a DSP, MCU framework for enhanced efficiency. Offers connectivity alternatives specified by CSI, I2C, UART for smooth integration. Incorporates core processor recognized as ARM® Cortex®-M3 for rapid processing. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 64-VFQFN Exposed Pad providing mechanical and thermal shielding. Enclosure type 64-HVQFN (9x9) ensuring device integrity. External devices PWM for system connectivity and expansion. Product condition Active for availability and lifecycle. Size of RAM 128kB for system or device specifications. Product or component classification series RZ/T. Velocity 138MHz for mechanical or data efficiency. Manufacturer package type 64-HVQFN (9x9) for component choice.

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