766141274GP
Data Sheet
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Circuit Configuration Style | Bussed | |
| Ohm Value Specification | 270k | |
| Accuracy Tolerance Percentage | ±2% | |
| Resistor Component Total | 13 | |
| IC Pin Total | 14 | |
| Wattage per Component | 80mW | |
| Temp Drift Factor | ±100ppm/°C | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 14-SOIC (0.154", 3.90mm Width) | |
| Package Size Specs | 0.341" L x 0.154" W (8.65mm x 3.90mm) | |
| Vertical Dimension | 0.069" (1.75mm) |
Description
Measures resistance at forward current Bussed for LED or diode evaluation. Utilizes a circuit type categorized as Bussed. Records a height of 0.069" (1.75mm) for precise dimensional accuracy. Mounting style Surface Mount for structural integrity. Total pins 14 for connectors or integrated circuits. Total resistors 13 for circuit design. Enclosure/case 14-SOIC (0.154", 3.90mm Width) providing mechanical and thermal shielding. Energy per unit 80mW for modular system assessment. Resistance measured in ohms 270k for precise electrical details. Dimensions 0.341" L x 0.154" W (8.65mm x 3.90mm) for mechanical or electrical components. Dimension measurement 0.341" L x 0.154" W (8.65mm x 3.90mm) for component details. Coefficient of temperature ±100ppm/°C for stability in performance. Tolerance ±2% for precision in manufacturing. Peak Vce(on) at Vge 270k for transistor parameters.
