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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HOTlink II™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | Receiver | |
| User Interface Type | LVTTL | |
| Electrical Circuit Count | 4 | |
| Power Supply Voltage | 3.135V ~ 3.465V | |
| Power Supply Amperage | 640mA | |
| Wattage Power Level | - | |
| Ambient Temp Range | 0°C ~ 70°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 256-BGA Exposed Pad | |
| Vendor Package Type | 256-L2BGA (27x27) |
Description
Utilizes supply current defined as 640mA. Crafted with Receiver function for adaptable component application. Interface tailored for LVTTL operation and interaction. Mounting style Surface Mount for structural integrity. Total circuits 4 for electrical or electronic designs. Operating temperature 0°C ~ 70°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 256-BGA Exposed Pad providing mechanical and thermal shielding. Enclosure type 256-L2BGA (27x27) ensuring device integrity. Product condition Obsolete for availability and lifecycle. Product or component classification series HOTlink II™. Manufacturer package type 256-L2BGA (27x27) for component choice. Voltage supply 3.135V ~ 3.465V for electrical needs. Operating supply voltage 3.135V ~ 3.465V for the device.
