SR37-LFM23S-3.5-0.8MM

SR37-LFM23S-3.5-0.8MM

Data Sheet

Attribute
Description
Manufacturer Part Number
SR37-LFM23S-3.5-0.8MM
Manufacturer
Description
SOLDER LEAD-FREE 0.8MM 100G
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Spool
Availability Status Active
Device Type Classification Wire Solder
Material Blend -
Circular Measurement 0.031" (0.79mm)
Fusion Temperature -
Solder Flux Category -
AWG Wire Size -
Filter Mesh Design -
Manufacturing Process Type Lead Free
Physical Form Factor Spool, 3.53 oz (100g)
Storage Duration Limit 24 Months
Expiration Start Date Date of Manufacture
Cool Storage Temp Range -

Description

Supplies diameter quantified at 0.031" (0.79mm). Employs a form factor characterized as Spool, 3.53 oz (100g). Enclosure Spool for component protection or transport. Type of process Lead Free for operational or production context. Product condition Active for availability and lifecycle. Product lifespan 24 Months for longevity. Beginning of shelf life Date of Manufacture for tracking storage. Category Wire Solder for classification or specification.

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