Attribute
Description
Manufacturer Part Number
NC2SWLF.031 1LB
Manufacturer
Description
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Note :
GST will not be applied to orders shipping outside of India
Stock: 1
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 4,640.46 | ₹ 4,640.46 |
Stock: 45
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 4,959.52 | ₹ 4,959.52 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Wire Solder | |
| Material Blend | Sn99.3Cu0.7 (99.3/0.7) | |
| Circular Measurement | 0.031" (0.79mm) | |
| Fusion Temperature | 441°F (227°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | 20 AWG, 21 SWG | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Spool, 1 lb (454 g) | |
| Storage Duration Limit | - | |
| Expiration Start Date | - | |
| Cool Storage Temp Range | - |
Description
Crafted from a material mixture described as Sn99.3Cu0.7 (99.3/0.7). Supplies diameter quantified at 0.031" (0.79mm). Utilizes a flux type categorized as No-Clean. Employs a form factor characterized as Spool, 1 lb (454 g). Melting temperature 441°F (227°C) for thermal and material integrity. Enclosure Bulk for component protection or transport. Type of process Lead Free for operational or production context. Product condition Active for availability and lifecycle. Category Wire Solder for classification or specification. Gauge of wire 20 AWG, 21 SWG for electrical standards.
