Attribute
Description
Manufacturer Part Number
SMDLTLFP250T3
Manufacturer
Description
SOLDER PASTE SN42/BI58 250G
Note :
GST will not be applied to orders shipping outside of India
Stock: 20
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 6,222.75 | ₹ 6,222.75 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | |
| Circular Measurement | - | |
| Fusion Temperature | 281°F (138°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | 3 | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Jar, 8.8 oz (250g) | |
| Storage Duration Limit | 6 Months | |
| Expiration Start Date | Date of Manufacture | |
| Cool Storage Temp Range | 37°F ~ 46°F (3°C ~ 8°C) |
Description
Crafted from a material mixture described as Bi57.6Sn42Ag0.4 (57.6/42/0.4). Utilizes a flux type categorized as No-Clean. Employs a form factor characterized as Jar, 8.8 oz (250g). Melting temperature 281°F (138°C) for thermal and material integrity. Mesh variant 3 for material or airflow requirements. Enclosure Bulk for component protection or transport. Type of process Lead Free for operational or production context. Product condition Active for availability and lifecycle. Product lifespan 6 Months for longevity. Beginning of shelf life Date of Manufacture for tracking storage. Storage/refrigeration temperature 37°F ~ 46°F (3°C ~ 8°C) to ensure material safety. Category Solder Paste for classification or specification.
