TS391SNL50

TS391SNL50
Attribute
Description
Manufacturer Part Number
TS391SNL50
Manufacturer
Description
THERMALLY STABLE SOLDER PASTE NO
Note : GST will not be applied to orders shipping outside of India

Stock:
131

Distributor: 117

Lead Time: Not specified

Quantity Unit Price Ext. Price
1 ₹ 1,596.83 ₹ 1,596.83

Stock:
286

Distributor: 108

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 1,597.55 ₹ 1,597.55

Stock:
64

Distributor: 121

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 2,456.47 ₹ 2,456.47

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Solder Paste
Material Blend Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Circular Measurement -
Fusion Temperature 423 ~ 428°F (217 ~ 220°C)
Solder Flux Category No-Clean
AWG Wire Size -
Filter Mesh Design 4
Manufacturing Process Type Lead Free
Physical Form Factor Jar, 1.76 oz (50g)
Storage Duration Limit 12 Months
Expiration Start Date Date of Manufacture
Cool Storage Temp Range 68°F ~ 77°F (20°C ~ 25°C)

Description

Crafted from a material mixture described as Sn96.5Ag3Cu0.5 (96.5/3/0.5). Utilizes a flux type categorized as No-Clean. Employs a form factor characterized as Jar, 1.76 oz (50g). Melting temperature 423 ~ 428°F (217 ~ 220°C) for thermal and material integrity. Mesh variant 4 for material or airflow requirements. Enclosure Bulk for component protection or transport. Type of process Lead Free for operational or production context. Product condition Active for availability and lifecycle. Product lifespan 12 Months for longevity. Beginning of shelf life Date of Manufacture for tracking storage. Storage/refrigeration temperature 68°F ~ 77°F (20°C ~ 25°C) to ensure material safety. Category Solder Paste for classification or specification.

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