AR 40-HZL-TT

AR 40-HZL-TT
Attribute
Description
Manufacturer Part Number
AR 40-HZL-TT
Description
CONN IC DIP SOCKET 40POS TIN
Note : GST will not be applied to orders shipping outside of India

Stock:
5395

Distributor: 117

Lead Time: Not specified

Quantity Unit Price Ext. Price
2508 ₹ 117.82 ₹ 2,95,492.56
1008 ₹ 125.64 ₹ 1,26,645.12
504 ₹ 131.94 ₹ 66,497.76
252 ₹ 138.56 ₹ 34,917.12
108 ₹ 147.10 ₹ 15,886.80
60 ₹ 153.33 ₹ 9,199.80
36 ₹ 158.97 ₹ 5,722.92
12 ₹ 171.82 ₹ 2,061.84
1 ₹ 205.11 ₹ 205.11

Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line -
IC Encapsulation Type Tube
Availability Status Active
Device Type Classification DIP, 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 40 (2 x 20)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Tin
Engagement Layer Thickness -
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Open Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Tin
Post Layer Depth 200.0µin (5.08µm)
Solder Tail Material Beryllium Copper
Casing Build Material Thermoplastic, Polyester
Ambient Temp Range -40°C ~ 105°C

Description

Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Provides connector spacing specified as 0.100" (2.54mm) for appropriate PCB arrangement. Features mating contact finish rated at Tin. Delivers post contact finish characterized by Tin. Designed with post finish thickness assessed at 200.0µin (5.08µm). Employs mating contact material identified as Beryllium Copper. Contains post contact material categorized as Beryllium Copper. Furnished with features classified as Open Frame. Made from Thermoplastic, Polyester housing material to ensure strength and dependability. Mounting style Through Hole for structural integrity. Pins or positions on grid 40 (2 x 20) for connector arrangement. Operating temperature -40°C ~ 105°C for thermal stability. Enclosure Tube for component protection or transport. Alignment pitch 0.100" (2.54mm) for connection with counterpart. Post spacing 0.100" (2.54mm) for mounting or PCB compatibility. Product condition Active for availability and lifecycle. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Termination method Solder for electrical or mechanical linkage. Category DIP, 0.6" (15.24mm) Row Spacing for classification or specification. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters.

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