4-1437531-5

4-1437531-5
Attribute
Description
Manufacturer Part Number
4-1437531-5
Manufacturer
Description
CONN IC DIP SOCKET 16POS GOLD
Note : GST will not be applied to orders shipping outside of India

Stock:
20

Distributor: 118

Lead Time: Not specified

Quantity Unit Price Ext. Price
8 ₹ 897.12 ₹ 7,176.96
3 ₹ 941.98 ₹ 2,825.94
1 ₹ 1,009.26 ₹ 1,009.26

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 500
IC Encapsulation Type Bulk
Availability Status Obsolete
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 16 (2 x 8)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness -
Connecting Pin Material Copper Alloy
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Wire Wrap
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth -
Solder Tail Material Copper Alloy
Casing Build Material -
Ambient Temp Range -55°C ~ 125°C

Description

Provides connector spacing specified as 0.100" (2.54mm) for appropriate PCB arrangement. Features mating contact finish rated at Gold. Delivers post contact finish characterized by Gold. Employs mating contact material identified as Copper Alloy. Contains post contact material categorized as Copper Alloy. Furnished with features classified as Closed Frame. Mounting style Through Hole for structural integrity. Pins or positions on grid 16 (2 x 8) for connector arrangement. Operating temperature -55°C ~ 125°C for thermal stability. Enclosure Bulk for component protection or transport. Alignment pitch 0.100" (2.54mm) for connection with counterpart. Post spacing 0.100" (2.54mm) for mounting or PCB compatibility. Product condition Obsolete for availability and lifecycle. Product or component classification series 500. Termination method Wire Wrap for electrical or mechanical linkage. Category DIP, 0.3" (7.62mm) Row Spacing for classification or specification.

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