Attribute
Description
Manufacturer Part Number
212024WE
Manufacturer
Description
CONN IC DIP SOCKET 24POS
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 24 (2 x 12) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | - | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | - | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | - | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | - | |
| Post Layer Depth | - | |
| Solder Tail Material | - | |
| Casing Build Material | - | |
| Ambient Temp Range | -30°C ~ 85°C |
Description
Provides connector spacing specified as 0.100" (2.54mm) for appropriate PCB arrangement. Furnished with features classified as Open Frame. Mounting style Through Hole for structural integrity. Pins or positions on grid 24 (2 x 12) for connector arrangement. Operating temperature -30°C ~ 85°C for thermal stability. Enclosure Bulk for component protection or transport. Alignment pitch 0.100" (2.54mm) for connection with counterpart. Post spacing 0.100" (2.54mm) for mounting or PCB compatibility. Product condition Active for availability and lifecycle. Category DIP, 0.6" (15.24mm) Row Spacing for classification or specification.